A look inside Apple’s new iPhone 5S and 5C
Technology firm iFixit tears down the new smartphones
Handout image released by iFixit.com shows a disassembled Apple iPhone 5S handset during a product teardown. Photograph: iFixit.com/Reuters
Apple’s newest smartphone models hit stores today in many countries across the world, including Australia and China. For the first time, Apple is selling a second smartphone dubbed the 5C featuring a plastic back and bright colors. The pricier 5S now comes in three new colors - gray, silver and gold.
Technology firm iFixit disassembled a gold-coloured iPhone 5S and examined its parts and then took apart a 5C model.
Following are some of the key parts for the 5S model:
- Chips from Avago Technologies and Skyworks Solutions are featured in the iPhone 5S.
- Companies supplying parts for the new phone also include South Korean memory chipmaker SK Hynix and radio-frequency chipmaker TriQuint Semiconductor.
- Broadcom Corp’s BCM5976 chip is used for the touchscreen controller.
- Murata Manufacturing’s 339S0205 (based on the Broadcom BCM4334) Wi-Fi module.
- Includes chips from Qualcomm (PM8018 RF power management IC) and Texas Instruments.
Following are some key points of the 5C model:
- The hardware design on the 5C appears more similar to the 5S than to the iPhone 5
- The 5C uses a Toshiba Corp 16 gigabyte flash memory chip
Information is from iFixit, a web site offering parts and self-repair guides for Apple iPods and Macintosh computers. The company, which has conducted similar “tear downs” on other Apple products, posted step-by-step photos of the process on its website (Reuters)